GOB (Glue on Board) is the technology of encapsulating the chip in the LED first, then soldering it on the PCB board, and finally using the epoxy resin with super high transparency and super thermal conductivity to do the integrated gluing.
Glue on board (GOB) technology. This innovative technology seals the module surface with transparent epoxy glue. This protects the LED from any harmful accidents by making it anti-collision, waterproof, anti-UV and dust proof.
